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Kinsus Interconnect Technology Corporation
http://www.kinsus.com.tw/Last activity: 30.07.2026
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Business:Kinsus Interconnect Technology Corp. engaged in manufacture and distribution of electronic parts. The Company provides plastic ball grid array (BGA) substrates, multi-chip-modules (MCM) BGA substrates, chip scale package (CSP) mini-BGA substrates, cavity down substrates, thermal enhanced-BGA substrates, flip chip substrates and chip on flex (COF), among others. Its products are applied in manufacture of chipsets, graphic chips, analog integrated circuits (ICs), logic ICs, flash memory products and dynamic random access memory (DRAM) products, among others.
Employees: 5001-10000
Founded date: 2000
Investors 1
| Date | Name | Website |
| - | The CID Gr... | cidgroup.c... |
Mentions in press and media 2
| Date | Title | Description |
| 30.07.2026 | TSMC Copies Intel’s Packaging Approach: New EMIB-Like Program With Kinsus Shakes Up AI Race | By Roger Satterfield Published: Jul 30 2026, 2:27 PM EDT Share on Facebook Share on Twitter Share on LinkedIn Share on Reddit Share on Flipboard |
| 21.05.2026 | AMD: $10 Billion Investment To Accelerate AI Infrastructure Through Taiwan Ecosystem Partnerships | AMD announced more than $10 billion in investments across the Taiwan ecosystem to expand strategic partnerships and scale advanced packaging manufacturing for next-generation AI infrastructure. The company said the investments are designed ... |