Syenta is transforming the electronics manufacturing sector. Our patented fabrication method enables the 3D printing of multi-material electronics with fewer steps and less waste.
Investors 2
| Date | Name | Website |
| 30.04.2023 | EnergyLab | energylab.... |
| 15.12.2022 | Blackbird ... | blackbird.... |
Mentions in press and media 6
| Date | Title | Description |
| 07.09.2023 | Startup Battlefield 200: Fintech and Hardware edition at TC Disrupt 2023 | If fintech, robotics and hardware are your thang, then get ready to get busy on the exhibition floor at TechCrunch Disrupt 2023 — it’s less than two weeks away! That’s where you’ll find the Startup Battlefield 200, our hand-picked cohort of... |
| 08.06.2023 | From infinite recycling to bat-like vision for blind people: Cicada Innovations announces the Tech23 startups | SYDNEY, June 8, 2023 /PRNewswire/ -- Australia's flagship deep tech incubator Cicada Innovations has announced its first cohort of deep tech founders chosen to showcase their world-changing innovations at Australia's longest-running annual ... |
| 15.12.2022 | Canberra 3D printing startup Syenta lands $3.7 million Seed round to revolutionise electronics manufacturing | Canberra-based manufacturing startup Syenta has raised $3.7 million in seed funding to drive production of its exceptionally fast, multi-material 3D printers. The round was led by Blackbird, alongside Brindabella Capital and Jelix Ventures.... |
| 30.06.2022 | Printed Electronics Market is expected to surpass the value of US$ 51.95 Bn by the end of 2031 | Printed Electronics Market is expected to surpass the value of US$ 51.95 Bn by the end of 2031 06-30-2022 12:01 PM CET | IT, New Media & Software Press release from: Transparency Market Research The global printed electronics market ... |
| - | Syenta | “Syenta is transforming the electronics manufacturing sector. Our patented fabrication method enables the 3D printing of multi-material electronics with fewer steps and less waste.” |
| - | Syenta | “Our manufacturing products build cutting edge advanced packaging for the semiconductor industry by combining patterning and metallization into a single tool.” |